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| Category | Resin |
| Chemical Name: | Hydrogenated bisphenol A Epoxy |
| CAS NO.: | 30583-72-3 |
| Molecular Formula: | C18H33ClO3 |
| Molecular Weight: | 332.91 |
| Application | Coating, ink, 3D printing and UV adhesive. |
| Features | Odorless, high sensitivity, excellent tissue compatibility and non-toxic. |
| Regular Package: | 20kgs/drum;210kgs/drum |
| Appearance: | Colorless clear liquid |
Chemical Structure:
